Device

Device Data

Options of Testing

DSC

Range of temperatures: -100 to 600°C,
DWDK, DLDK and Tzero with autosampler
nitrogen and oxygen rinsing

Determination of transition temperatures/ material modifications,
determination of enthalpies of melt, crystallization and reaction
Information as to thermal history

TMDSC

Range of temperatures: -70 to 600°C
Tzero with autosampler
nitrogen and oxygen rinsing

Measurement of heat capacities,
differentiation between reversible and non-reversible effects

DPC

Range of temperatures: -100 to 600°C
DLDK, Xenon lamp, monochromator

Observing UV-induced reactions

TMA

Range of temperatures:-70°C to 400°C
Various core punch geometries, clamping of films and sheets

Behaviors of expansion and/or shrinkage in different directions

Determination of glass transition temperatures

TG

Range of temperatures: RT to 1200°C
nitrogen and oxygen rinsing

Weight loss as a function of temperature and time

Decomposition behavior

DMA

Range of temperatures: -120 to 450°C
types of load: torsion, tension, bending, compression
range of frequencies: 0.01 to 100 Hz

Modules of storage and loss, mechanical damping as a function of temperature and time

µTA

Range of temperatures: RT to 600°C
range of measurements: 100 x 100 µm
Max. deflection: 10 µm

Images of topography and heat conductivity

Local thermal analysis

Heat conductivity

Hot disk technique
range of temperatures: RT
measurements in a molten state in a pvT measuring device under pressure
range of temperatures: 40 to 300°C
range of pressures: 1 to 800 bar

Measurement of the heat conductivities in plate specimens of 4mm thickness and more, and of melts

Thermal conductivity

Nanoflash technique:
range of temperatures: RT to 300°C

Measurement of thermal conductivities in plate specimens and sheets